台灣今日更新的7個chiplet職缺機會
個職缺
Job Description Familiar to 2.5D or 3D PKG integration & development & mass production experience 2. From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration Main Requirements and Qualifications Understanding TSMC, INTEL, OSAT 2.5D PKG technolo
Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a
QualcommCompany: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: We are looking for a Senior Engineer in Digital Test Engineering to support and drive SoC | Chiplet test program bring‑up and validation from NPI through high‑volume manufac
美商高通國際股份有限公司Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: We are looking for a Senior Engineer in Digital Test Engineering to support and drive SoC | Chiplet test program bring‑up and validation from NPI through high‑volume manufac
MediaTek*Job Description** Familiar to 2.5D or 3D PKG integration & development & mass production experience From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration *Requirement** Understanding TSMC, INTEL, OSAT 2.5D PKG technology Understand TSMC, IN
MediaTek*Job Description** Familiar to 2.5D or 3D PKG integration & development & mass production experience From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration *Requirement** Understanding TSMC, INTEL, OSAT 2.5D PKG technology Understand TSMC, IN
聯發科技Job Description Familiar to 2.5D or 3D PKG integration & development & mass production experience From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration Requirement Understanding TSMC, INTEL, OSAT 2.5D PKG technology Understand TSMC, INTEL 3D
$480,000 – $765,000每年
估算信賴度：Low
根據市場資料估算。實際薪資可能因經驗、企業和地區而異。
尋找台灣主要城市的chiplet職缺