台灣今日更新的1,355個ic design engineer職缺機會
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· 頁 1 / 68Company Description We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, per
QualcommCompany Qualcomm Semiconductor Limited Job Area Engineering Group, Engineering Group > Packaging Engineering General Summary Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, tea
We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, performance, and manufa
Company Description We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, per
We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, performance, and manufa
Company Description We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, per
Company Description We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, per
Company Description We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, per
We are seeking a highly experienced IC Package Design Engineer with extensive expertise across a broad range of semiconductor package types. The ideal candidate is proficient in industry-standard package design tools and possesses a strong understanding of package structures, performance, and manufa
Job Description Design the Serdes high speed connection PHY architecture which targets at data center and AI products. The role of this position is to design and deliver the ASIC products to world class customer. You will contribute and build a Serdes PHY design which has low power, cost-effective,
We are seeking Principal Analog Engineer to serve as a global technical authority who drives quality, technical execution, and engineering capability across complex integrated circuit development. This role spans the full lifecycle from specification and customer engagement through design, verificat
We are seeking Principal Analog Engineer to serve as a global technical authority who drives quality, technical execution, and engineering capability across complex integrated circuit development. This role spans the full lifecycle from specification and customer engagement through design, verificat
Job Description The candidate will design, supervise layout, help characterize transceiver front-end circuits for WiFi and Bluetooth production. Main Requirements and Qualifications The ideal candidate would have an excellent track record in RFIC design and verification. MS or PhD degree in Electric
Job Description Architecture design and RTL implementation for Smartphone and automotive chip 2. Smartphone SoC and mobile computing platform design. 3. System bus and high speed interface designs Main Requirements and Qualifications Familiar with digital IC design, DFT, and FPGA emulation flow Expe
Job Description We’re Looking for You! (Each applicant may apply for up to five positions in the 2027 Campus Recruitment Program.) If you are a 2027 Master’s or Ph.D. graduate with a background in Electrical Engineering, Electronics, Computer Science, Computer Engineering, Information Management, Te
Job Description We’re Looking for You! (Each applicant may apply for up to five positions in the 2027 Campus Recruitment Program.) If you are a 2027 Master’s or Ph.D. graduate with a background in Electrical Engineering, Electronics, Computer Science, Computer Engineering, Information Management, Te
Job Description Co-work with algorithm, digital/analog design, firmware, AI tool teams. 0+ ~ 10+ Years Experience in: Agentic AI Workflow/Tool Evaluation/Deployment Data Center & • High-Speed SerDes Design Verification Plan & • Project Execution Automotive Design Verification Plan & • Proje
Job Description Develop and implement DRAM controller/PHY solutions for data-center applications. Validate functionality, improve design to optimize performance, power, latency and efficiency. 2. Memory controller/PHY Integration: Design and integration memory system. Main Requirements and Qualifica
Job Description Flagship Smartphone chip integration 2. Automotive SoC chip integration 3. Clock architecture 4. Timing constraint and analysis 5. DFT/test mode implementation Main Requirements and Qualifications Experience with RTL design, integration(SOC and IPs) and verification Knowledge of STA,
QualcommCompany: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Description Product and Test Engineering (PTE) is looking for Mixed Signal Test Engineers who will create test solutions in support of New Product Introduction (Silic
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