台灣今日更新的1,227個ic design engineer職缺機會
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· 頁 1 / 62Job Description The candidate will design, supervise layout, help characterize transceiver front-end circuits for WiFi and Bluetooth production. Main Requirements and Qualifications The ideal candidate would have an excellent track record in RFIC design and verification. MS or PhD degree in Electric
Lattice Overview There is energy here…energy you can feel crackling at any of our international locations. It’s an energy generated by enthusiasm for our work, for our teams, for our results, and for our customers. Lattice is a worldwide community of engineers, designers, and manufacturing operation
聯發科技Job Description We’re Looking for You! (Each applicant may apply for up to five positions in the 2027 Campus Recruitment Program.) If you are a 2027 Master’s or Ph.D. graduate with a background in Electrical Engineering, Electronics, Computer Science, Computer Engineering, Information Management, Te
聯發科技Job Description We’re Looking for You! (Each applicant may apply for up to five positions in the 2027 Campus Recruitment Program.) If you are a 2027 Master’s or Ph.D. graduate with a background in Electrical Engineering, Electronics, Computer Science, Computer Engineering, Information Management, Te
聯發科技Job Description We’re Looking for You! (Each applicant may apply for up to five positions in the 2027 Campus Recruitment Program.) If you are a 2027 Master’s or Ph.D. graduate with a background in Electrical Engineering, Electronics, Computer Science, Computer Engineering, Information Management, Te
聯發科技Job Description Digital IC Design Multimedia Architecture and Design Multimedia System Integration Main Requirements and Qualifications 1. Familiar with digital IC design flow 2. Experienced in digital circuit integration 3. Experienced in multimedia or Display digital design 4. Experienced in low-p
Job Description Architecture design and digital circuit design. 2. RTL implementation and verification. 3. IC implementation from RTL to netlist and related sign-off flow with EDA tools. 4. Design PPA analysis and optimization Main Requirements and Qualifications Have some experiences in digital des
QualcommCompany: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Role Overview We are seeking an IC Package Design Engineer to support the planning, coordination, and execution of IC package design activities across complex semiconduc
QualcommCompany: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Role Overview We are seeking an IC Package Design Engineer to support the planning, coordination, and execution of IC package design activities across complex semiconduc
Job Description Fully custom layout design for analog, RF circuit, 3D-IC Silicon Interposer, and automation flow development. Main Requirements and Qualifications * Bachelor's or Master's in a closely related field, e.g., EE, CE, CS, etc. * Minimum 3 years relevant industrial experience in analog/RF
Job Description Work with design teams to do performance sign off in pre-silicon stage 2. ESL platform and simulation/emulation technology development. 3. Model development (includes behavior modeling/ cycle approximate modeling) Main Requirements and Qualifications Familiar with Verilog/SystemVeril
聯發科技Job Description Serdes/High speed interface related PHYD IP architecture planning 2. Serdes/High speed interface related PHYD IP RTL coding 3. Serdes/High speed interface related PHYD IP front-end and back-end integration 4. Co-work with MAC design team and DV team for IP verification 5. Co-work wit
QualcommCompany: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > ASICS Engineering General Summary: Overview Qualcomm is a global leader in next‑generation wireless and multimedia technologies, committed to delivering world‑class products that elevate user experiences acro
Winbond Electronics Corporation【工作內容】 作為華邦的(竹北) MCU/SoC IC Design Engineer， 1. Design CIM SoCs and modules. 2. Develop modules for CIM-based SoCs. 3. SoC design, integration, and verification. 【工作地點】竹北辦公室(新竹縣竹北市文興路二段539號) 【條件要求】 學歷要求：碩士 科系要求：電機電子工程相關 │ │ 相關經驗：5年以上 語言能力：英文 高級 │ │ 管理責任：No 輪班需求：No 出差需求：無 外派需求：No
Job Description RTL design Digital IC design Digital multimedia system design SOC Integration Bus architecture design Main Requirements and Qualifications Familiar with digital IC design Experienced in SOC architecture or FPGA verification Experienced in video/image processing is a plus Experienced
Job Description MTK's Power management team designs power management integrated circuits (PMICs) and power management units (PMUs) for a variety of smart phones, IOT, automotive, and ASIC products. The designs include 1. DC-DC converters, 2. Low drop out linear voltage regulators (LDOs), 3. Switchin
About the Team NXP Semiconductors is seeking an Analog IC Layout Engineer to join the Central Layout Group serving the Power & Energy Business Line, with a primary focus on Automotive Power Solutions (APS). The Central Layout Group delivers physical implementation expertise for complex mixed-sig
Marvell TechnologyAbout Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual
Marvell TechnologyAbout Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual
聯發科技Job Description Power management IC spec definition, new IP development planning and verification. Analog IP development and verification. Main Requirements and Qualifications 2+ years experience in analog or power management IC verification
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