81 module opportunities in Phoenix updated today
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· Page 1 / 5Job Details: Job Description: Join Intel's Packaging Module Development team and play a pivotal role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will develop innovative material and design solutions that drive Intel's roadmap for next-gen
Job Details: Job Description: In this position, you will be responsible for advancing packaging process development through the following responsibilities: Develops assembly processes and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform
Job ID R2617983 Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – th
Intel CorporationJob Details: Job Description: Join Intel's Packaging Module Development team and play a pivotal role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will develop innovative material and design solutions that drive Intel's roadmap for next-gen
A leading semiconductor company in Phoenix, Arizona, seeks an Advanced Packaging Research and Development Engineer. This role involves driving innovation in advanced IC packaging solutions and optimizing processes. Responsibilities include developing panel-level processes, collaborating with cross-f
*Posting Date** 02/05/26 *Application Deadline** Open Until Filled *Pay Range** $60,000 - $105,000 annually Salary offers are based on the candidate's equivalent experience and internal equity with other employees within the same job classification. This position is not eligible for overtime compens
# **Job Details:** ## **Job Description:** *The Role and Impact** Join Intel's Advanced Packaging Technology Development team as an **Advanced Packaging Research and Development Engineer** where you will drive innovation and help shape the future of advanced IC packaging solutions. In this role, you
Assistant Plant Controller, Solar Module Date: Mar 19, 2026 Location: Phoenix, AZ, US, 85353 Company: Corning Requisition Number: 72789 The company built on breakthroughs. Join us. Corning is one of the world's leading innovators in glass, ceramic, and materials science. From the depths of the ocean
RIT Solutions, Inc.Title: Azure Module Developer Location: Chandler, AZ (3 days onsite at Client / 2 days remote) I was on a call with a hiring manager this afternoon and he has 2 immediate needs. One position is focused on Azure and the other on AWS. The job description is below for the Azure position but here is wha
GovernmentJobs.comWorkday Benefit Systems Analyst Maricopa County is currently seeking a Workday Benefit Systems Analyst. This position will primarily focus on supporting Workday Benefit configuration, reporting, and/or integrations. The System Analyst will work closely with the Workday Benefit Administrator and othe
Arizona StaffingJob Opportunity at Deloitte Our Deloitte Human Capital team helps organizations create value through people performance. We work with clients to reimagine work, the workforce, and the workplace across the enterprise and to transform their HR functions with AI and emerging technology. With the rapid
# **Welcome!**## .Packaging Module Development Engineer page is loaded## Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282474# **Job Details:**## Job Description:The Advanced Packaging Technology Manufacturing (A
Select how often (in days) to receive an alert: TSMC is looking for managers in the following modules: CMP, CVD, Diffusion, Epitaxy, Etch (Dry), Etch (Wet), Lithography, Metrology , and PVD . At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most
Module Engineering Managers TSMC is looking for managers in the following modules: CMP, CVD, Diffusion, Epitaxy, Etch (Dry), Etch (Wet), Lithography, Metrology, and PVD. At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators
# **Welcome!**## .Packaging Module Development Engineer page is loaded## Packaging Module Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Yesterdayjob requisition id: JR0282430# **Job Details:**## Job Description:The Advanced Packaging Technology Manufacturin
A leading semiconductor company in Phoenix, Arizona, is seeking a Packaging Module Development Engineer to advance semiconductor packaging technology. The role involves mechanical modeling support for R&D and collaboration with engineers. Candidates should have a Ph.D. in a relevant field and over 8
Corning IncorporatedAssistant Plant Controller, Solar Module Date: Mar 19, 2026 Location: Phoenix, AZ, US, 85353 Company: Corning Requisition Number: 72789 The company built on breakthroughs. Join us. Corning is one of the world's leading innovators in glass, ceramic, and materials science. From the depths of the ocean
Workday HRIS Analyst (Benefits Module) – Maricopa County Posting Date: 11/12/25 Application Deadline: Open Until Filled Pay Range: $60,000 - $105,000 annually Job Type: Unclassified Department: Human Resources Maricopa County is currently seeking a Workday Benefit Systems Analyst. This position will
Corning IncorporatedAssistant Plant Controller, Solar Module Date: Mar 19, 2026 Location: Phoenix, AZ, US, 85353 Company: Corning Requisition Number: 72789 **The company built on breakthroughs. ** **Join us. ** Corning is one of the world's leading innovators in glass, ceramic, and materials science. From the depths of
A global semiconductor leader in Phoenix, Arizona is seeking a Packaging Module Development Engineer to advance semiconductor packaging technologies. The role involves developing interconnect solutions and collaborating with teams to optimize assembly processes. Candidates must have a Master's Degre
Azure Module Developer Location: Chandler, AZ (3 days onsite at client / 2 days remote) I was on a call with a hiring manager this afternoon and he has two immediate needs. One position is focused on Azure and the other on AWS. The job description is below for the Azure position but here is what he
Overview The University of Southern California (USC) department of Facilities Planning & Management (FPM) is seeking an Engineer Module C to join its team. About USC FPM FPM (formerly named Capital Construction & Development / Facilities Management Services) is responsible for planning, developing,
onsemi is seeking a Thin Films Engineer. You will develop and support the manufacturing of 300mm silicon wafers used for Automotive and Consumer applications throughout the world. You will also provide process engineering support for additional process areas. In this team-based environment, you will
OnsemiJob Description onsemi is seeking a Thin Films Engineer. You will develop and support the manufacturing of 300mm silicon wafers used for Automotive and Consumer applications throughout the world. You will also provide process engineering support for additional process areas. In this team-based envir
Job Description onsemi is seeking a highly skilled and motivated Engineering Manager as an integral member of the management team. The successful candidate will find they have a daily opportunity to make a significant difference to a growing, emerging, and energetic organization. The successful cand
Overview Job Description onsemi is seeking a highly skilled and motivated Engineering Manager as an integral member of the management team. The successful candidate will have a daily opportunity to make a significant difference to a growing, emerging, and energetic organization, with substantial lea
Description Acara Solutions has been providing advanced manufacturing firms across the U.S. with our engineering, technical and professional staffing services for close to 70 years. Our American based semiconductor client has a Lead RTP Module Technician direct employee position with full benefits.
Corning IncorporatedRequisition Number: 72789 The company built on breakthroughs. Join us. Corning is one of the world's leading innovators in glass, ceramic, and materials science. From the depths of the ocean to the farthest reaches of space, our technologies push the boundaries of what's possible. How do we do this?
Job Description onsemi is seeking a Lead RTP Module Technician in a 300mm automated line, Hopewell Junction, NY. Will guide training and troubleshooting on AMAT Vantage and Centura systems. The position is intended to be a night position. Responsibilities React to error messages of factory systems a
$40,000 – $63,000/year
Estimation confidence: Low
Estimate based on market data for Phoenix. Actual salaries may vary depending on experience, company, and area.
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