Job Description: Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs f
Job Description: Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In the role, you will have primary responsibility for the layout, routing, and functionality of packages and substrates, including design of high-speed lines. Expertise with design tools, such as Cal
The application window is expected to close on: 05/31/2026Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received. This role can be performed onsite in San Jose, CA or remotely within the US. Meet the Team Join the Cisco Silicon One team in
The application window is expected to close on: 05/31/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . This role can be performed onsite in San Jose, CA or remotely within the US. Meet the Team Join the Cisco Silicon One team
About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual
Job Description Role Summary: We are seeking a Senior Package Design Engineer to join our custom SOC/ASIC development client. Youll work closely with cross-functional teams in the U.S. and overseas on high-performance package substrate design with a focus on signal/power integrity and routing. Key R
About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual
About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual
About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual
Role: Silicon Design Package Engineer Location: Santa Clara, CA This role is highly specialized in semiconductor packaging design, requiring strong EDA tool proficiency and knowledge of advanced packaging technologies Tools & Knowledge: Mentor/Siemens and Cadence tools (especially for Package La
What To Expect The Tesla AI Hardware team is at the forefront of revolutionizing artificial intelligence through cutting-edge hardware innovation. Comprising brilliant engineers and visionaries, the team designs and develops advanced AI chips tailored to accelerate Tesla’s machine learning capabilit
Join us in an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) at NVIDIA. Using our history of innovation, you will contribute to the next era of computing, driven by AI and pioneering technology. As part of our team, your efforts will directly aff
About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual
About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual
Your Team, Your Impact Advanced Packaging Physical Design for Photonic Fabric BU What You Can Expect Package Design: Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of p
*About Marvell** Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individu
*About Marvell** Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individu
Arm Principal Package Layout Engineer Arm has a great opportunity for a Principal Package Layout Engineer in our System-in-Package team! This Engineer will be part of a team responsible for implementing ARM’s next generation of SoC’s in the IoT, Automotive, and Compute spaces. These complex designs
A leading silicon IP provider in San Jose is seeking a Senior Package Design Engineer to support design and layout of innovative products. In this full-time role, you'll work with multi-disciplinary teams to drive package design from concept to production. Candidates should have an MS in EE/CE, 5+ y
*About Marvell** Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individu
A leading silicon IP provider in San Jose is seeking a Senior Package Design Engineer to support design and layout of innovative products. In this full-time role, you'll work with multi-disciplinary teams to drive package design from concept to production. Candidates should have an MS in EE/CE, 5+ y
*About Marvell** Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individu
Please Note: 1. If you are a first time user, please create your candidatelogin account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom is seeking an experienced IC package-design engi
Overview We are now looking for a Package Design Engineer in the Advanced Technology Group (ATG). NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative solutions to extraordinary problems in a wide range of sector
Overview BROADCOM is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificia
Executive Recruiter and Account Manager for Semiconductors, Defense, and AI Our client is seeking an experienced Package Design Engineer for complex flip‑chip‑BGA packages for industry‑leading ASICs with high‑speed SerDes and RF/microwave communications A/D D/A converters (ADC & DAC). You will be pa
Role description Package Design Engineer Associate III - Product Design Who We Are: Born digital, UST transforms lives through the power of technology. We walk alongside our clients and partners, embedding innovation and agility into everything they do. We help them create transformative experiences
Our client is seeking an experienced Package Design Engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for A
What to Expect Our team isseekinga highly motivated IC Package Integration Engineer to lead IC package manufacturing integration, yield, quality, and supply continuity for next-generation AI compute platforms. This role sits at the intersection of package design, manufacturing process development, a