*Who We Are** Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of d
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devi
*Who We Are** Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of d
Overview The Product Developer Director is responsible for building and refining Innovation pipelines and MVPs based on chef-created gold standards. This role sits at the intersection of culinary vision and technical feasibility—translating ideas into tangible product forms that work in real-world p
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devi
*Role Overview** We are seeking two highly skilled Mechanical Engineers with experience in the Aerospace & Defense sector to support the development and integration of advanced thermal management subsystems used across military and commercial platforms globally. This role focuses on mechanical s
About GlobalFoundries: GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefron
*About GlobalFoundries:** GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the foref
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products,
At Meta, we’re building the future of human connection and the technology that enables it. This means continuously inventing and developing technologies for the next generation of experiences. To continue our efforts in the path to AGI, and as we move closer to a future with intelligent robots and a
*WHAT YOU DO AT AMD CHANGES EVERYTHING** At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold
Join the Photonics Platform Business Group within the CTO Office at Applied Materials' Santa Clara headquarters, where you will work with a world-class research team developing next-generation silicon photonics packaging technologies. This role focuses on enabling high-performance optical interconne
Director Advanced Packaging (2.5D/3D)– Advanced Materials & Thermal Integration Location: San Jose, CA Company: Destination 2D Inc. Destination 2D is pioneering CMOS-compatible graphene technologies that are redefining semiconductor performance—from novel 2.5D/3D packaging and device thermal managem
Mechanical Engineer – Aerospace Thermal Management Systems (Integration & Packaging) Location: Onsite – Irvine CA Industry: Aerospace & Defense Citizenship Requirement: U.S. Citizen Role Overview We are seeking two highly skilled Mechanical Engineers with experience in the Aerospace & Defense sector
Job Description The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging. Key Attributes: Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV
Job Description The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging. Key Attributes: Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV
• You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with advanced package solutions, new material developments, and specs BS and 10+ years of experience in relevant industry experienc
• You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with advanced package solutions, new material developments, and specs BS and 10+ years of experience in relevant industry experienc
• You will be responsible for IC packaging development • Work with cross-functional teams and lead SoC Package integration and architecture efforts • Drive the industry with advanced package solutions, new material developments, and specs BS and 10+ years of experience in relevant industry experienc
Summary of Role: This hands-on packaging assembly integration role will deliver industry leading electro-optical transceivers using GF's Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on tool
Frequently asked questions about Packaging Integration
How much does a Packaging Integration earn in United States?
The estimated salary for Packaging Integration in United States ranges from $25,000 to $40,000 USD per year, depending on experience and location.
How many Packaging Integration jobs are available?
There are currently 28 job offers for Packaging Integration in United States listed on BeBee.
Which cities have the most Packaging Integration jobs?
The cities with the most Packaging Integration jobs in United States are: Santa Clara.
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