Alexandra Kasper

Passionate engineer with background in data analytics, laser processing, wafer chemistry, and automation. Recent focus on standardizing back-end data infrastructure and front-end data tools for high volume manufacturing, including statistics-based automated analytics. A proven team leader with a dynamic, methodical, and objective approach to ranking competing priorities to tackle both technical and business problems.

Senior Process Development Engineer, New Product Introduction, Illumina Inc. 1/23-6/24

• Orchestrated down-selection of data strategy for new 13-tool automated manufacturing line
  • Developed end-user requirements for trend charts, automated analytics, and data pipelines
  • Ingested log files to SQL Postgres database via python and trended via Tableau
• Daily monitoring of product and process data, responding to issues by independent investigation and escalation, as necessary
• Created and distributed a standardized template for Statistical Process Control (I-Chart, P-Chart, X-Bar-R, MA-Chart, etc.) in Tableau, with SPC zone rule flags via calculated fields
• Led and Executed thorough Critical Parameter Management (CPM) for O2 plasma ashing of glass wafers

 Process Development Engineer II, Sustaining, Illumina Inc. 7/20 -12/22

• Owned UV Laser Module – Led 4-person support team for 24/7 fleet of 6 high-power laser systems
• Created tools for monitoring process & tool health, managed team prioritization of daily and long-term efforts around investigation, troubleshooting, and implementation of tool and process improvements
• Managed R-script-based dynamic capacity model for laser systems, and increased capacity by 34%
• Designed and executed DOEs for optimizing laser processes for 1) cutting features out of glass for mechanical alignment between wafers and 2) creating precise features in polyimide film 
• Developed, Gage R&R’d, and documented BF microscopy-based test method for laser-cut glass edges
• Orchestrated validation (requirements, specifications, and test protocol drafting + timeline management) for automated UV Laser-based wafer marking system
• Generated recipes for cutting lines of various depths and widths for raw material scratch spec setting