Steven Donow

Senior Electrical Engineer with 8+ years of experience designing and sustaining complex multi-layer PCBs for aerospace, defense, and high-reliability applications. Expert in Altium Designer, analog and mixed-signal electronics, DFM/DFT, and IPC standards compliance. Proven track record leading PCB design initiatives from concept through production, with deep expertise in EMC/EMI mitigation, signal integrity, and fabrication-driven design optimization.

Strong collaborator who bridges design, manufacturing, and supply chain teams to deliver safety-critical solutions on schedule.

Senior Sustaining Electrical Engineer at Boston Dynamics (2022-08 – Present)

• Led multi-layer PCB design and layout optimization for safety-critical robotic systems, ensuring compliance with IPC standards and EMC/EMI requirements across 12+ product variants.
• Championed DFM/DFT reviews with manufacturing partners, reducing first-pass yield failures by 34% through stackup redesign and fabrication process improvements.
• Developed and maintained Altium Designer libraries and design standards; mentored junior engineers on signal integrity best practices, high-speed routing, and thermal management.
• Collaborated with product and supply chain teams to identify and resolve component obsolescence issues, ensuring continuity for 8 legacy platforms and reducing redesign cycles by 6 months.
• Executed board-level troubleshooting and root-cause analysis for field-reported EMI issues, implemented shielding and filtering solutions that eliminated 18 reported failures.
• Drove schematic capture standardization across 40+ designs, improving design review efficiency and reducing documentation rework by 40%.

Electrical and Electronics Engineer at XL Fleet (2021-09 – 2022-07)

• Designed and validated mixed-signal PCBs for vehicle electrification systems, integrating power management, CAN bus controllers, and sensor interfaces using Altium Designer.
• Performed DFM analysis and collaborated with PCB fabricators to optimize stackup, trace widths, and via placement, reducing manufacturing cost per unit by $12.
• Conducted EMI/EMC pre-compliance testing and implemented filtering strategies to meet automotive regulatory standards, achieving first-time certification.
• Managed PCB revision cycles from schematic through production release, balancing performance, cost, and manufacturability constraints.

Associate Electrical Engineer at QinetiQ US (2019-02 – 2021-06)

• Designed and laid out complex analog and mixed-signal PCBs for defense applications, emphasizing signal integrity and adherence to IPC standards.
• Applied DFT principles to support production testing; designed test points and boundary scan architecture for multi-layer boards, reducing test time by 28%.
• Participated in design reviews and DFM assessments with manufacturing teams, identifying and mitigating fabrication risks early in development.
• Created detailed PCB documentation and managed design files in version control, supporting multiple concurrent programs.

Electrical Engineering Co-op at General Dynamics Mission Systems (2017-01 – 2017-06)

• Supported PCB layout and component placement for defense-grade electronics, learning multi-layer PCB design fundamentals and IPC compliance.
• Assisted with schematic capture and symbol creation in Altium Designer, contributing to reusable design libraries.
• Reviewed fabrication drawings and test specifications, gaining practical knowledge of manufacturing constraints and signal integrity principles.

RF/Microwave Engineering Intern at Analog Devices (2016-01 – 2016-06)

• Developed SPICE simulations and evaluated analog circuit topologies for RF applications, building foundation in mixed-signal electronics and component characterization.
• Supported PCB evaluation board layout, gaining exposure to transmission line theory, impedance control, and analog design best practices.

Bachelor of Science in Electrical Engineering – Northeastern University (2013 – 2018)

High School Diploma – Lakeland Regional High School (2009 – 2013)