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Antariksh Saxena

Antariksh Saxena

Reliability & Qualification Engineer | AEC-Q100 | HTOL, Thermal Shock, Thermal Cycling, Humidity | Failure Analysis | Optoelectronic Packaging

Talent
Milton KeynesMember since August 17, 2026
MS ProjectOffice TimelineLine ManagementTechnical EvaluationsRFQs8D/RCADFMACost ReductionSpecificationsQualification CriteriaLCOSLiquid CrystalsAlignment LayersEncapsulantsAEC-Q100CAPASEMMATLABCOMSOLHTOLthermal shockpower-on thermal cyclinghumidityCSAMCT8DDOELean Six Sigma
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MS ProjectOffice TimelineLine ManagementTechnical EvaluationsRFQs

About

Reliability and qualification engineer with 7+ years of industrial experience qualifying silicon-backplane LCOS devices for automotive head-up displays to AEC-Q100 and GM standards. Executed HTOL, thermal shock, power-on thermal cycling and humidity stress qualification across EV, DV and PV builds (1,000+ parts, then a final 500-part round), with failure analysis (CSAM, CT, SEM) and 8D/CAPA on rejects. Brought the GM HUD programme to high-volume production (delivered 2025), raising yield from 60% to 95%.

Ph.D. in Physics; co-inventor on 9 patents.

Experience

Lead Engineer - Dualitas Ltd - Milton Keynes, UK

(2026-06)

  • Leading technical and market benchmarking of LCOS spatial light modulators for AI applications and defining the development roadmap.

Lead Architect & LCOS Developer (Contract / Advisor) - Inmersia - Barcelona, Spain

(2026-03 - 2026-06)

  • Defined the specification and architecture for a ferroelectric LCOS microdisplay for AR/VR with the silicon backplane supplier, completed in two months.

Lead Materials & Display Manager (Manufacturing Readiness & Process NPI) - Envisics Ltd - Milton Keynes, UK

(2019-05 - 2026-05)

LCOS for automotive head-up display (HUD)

  • Led reliability and packaging qualification of silicon-backplane LCOS devices to AEC-Q100 and GM requirements (HTOL, thermal shock, power-on thermal cycling, humidity), bringing the GM HUD programme to high-volume production (2025).
  • Translated GM quality and reliability requirements into material specifications, CTQ parameters, control plans and qualification plans for multi-stage cleanroom packaging assemblies.
  • Led 8D and root-cause investigations into stress failures and non-conformances (CSAM, CT, SEM); deployed CAPAs that eliminated recurring defects.
  • Raised yield from 60% to 95% and cut cycle time by 30% using Lean Six Sigma and DFMA.
  • Qualified 10 major sub-component suppliers, authored technical RFQs, set IQC metrics and aligned processes with the China-based OSAT partner.
  • Line managed a 13-person production and engineering team, including an engineer embedded at the OSAT line.

Senior Liquid Crystal Scientist - Envisics Ltd - Milton Keynes, UK

(2019-05 - 2026-05)

LCOS for automotive head-up display (HUD)

  • Part of the team that developed Envisics’ first automotive LCOS device for GM, from prototype through to qualification.
  • Directed AEC-Q100 qualification and validation campaigns using DOE and process capability evaluations: 1,000+ parts across EV, DV and PV stages ahead of the final 500-part round.
  • Led continuous improvement initiatives that increased operational efficiency by 20% and reduced scrap and material cost.

Research Fellow (Cleanroom Operations & Fabrication) - University of Leeds - UK

(2018-04 - 2019-05)

  • Managed cleanroom microfabrication operations and supervised postgraduate engineering projects.

Research Assistant & Project Lead - Nottingham Trent University / Merck KGaA - UK

(2017-06 - 2018-03)

  • Delivered an industrially funded process feasibility study for Merck, modelling fluid flow and viscosity in MATLAB.

Education

Ph.D. - Physics - Nottingham Trent University, UK (2018)

Integrated M.Tech & B.Tech - Nanotechnology - Amity University, India (2013)

Skills

Reliability & Qualification EngineerAEC-Q100HTOLThermal ShockThermal CyclingHumidityFailure AnalysisOptoelectronic Packaging

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