Geeta B

To Work on Projects with New Product Development/New Product Introduction and Product Evolution Process (PEP). Responsible for Industrialization of New PCB Assembly in New Product Development/ Introduction.

To Work

Closely with Engineering Teams, Electronic Manufacturing Services (EMS) and Manufacturing Plant during PCBA industrialization. Work Closely with Engineering Teams during PCB Assembly Design, Conduct Design for Manufacturability (DFM) using tools (Valor, etc). Have good Knowledge on PCB Design and understanding of Various Electronic Component Packages and Component Footprint, PCB layers, Fabrication technology and surface finish.

Good Knowledge of IPC-A-610 Standards for Electronics Assembly. Hands-on Experience on End-to-End PCB Assembly (SPI, Reflow, AOI, Wave, Conformal Coating, PCBA Testing component Traceability, ESD, component storage and Handling), PCBA Equipment's/ Manufacturing Engineering. Firmware and Component/Chip level Programming.

Deputy Manager (PCBA Process) - Schneider Electric India Pvt. Ltd. - Bangalore, India

(2022-10)

• To Work on Projects with New Product Development/New Product Introduction and Product Evolution Process (PEP). Responsible for Industrialization of New PCB Assembly in New Product Development/ Introduction.
• To Work Closely with Engineering Teams, Electronic Manufacturing Services (EMS) and Manufacturing Plant during PCBA industrialization. Work Closely with Engineering Teams during PCB Assembly Design, Conduct Design for Manufacturability (DFM) using tools (Valor, etc). Have good Knowledge on PCB Design and understanding of Various Electronic Component Packages and Component Footprint, PCB layers, Fabrication technology and surface finish.
• Good Knowledge of IPC-A-610 Standards for Electronics Assembly. Hands-on Experience on End-to-End PCB Assembly (SPI, Reflow, AOI, Wave, Conformal Coating, PCBA Testing component Traceability, ESD, component storage and Handling), PCBA Equipment's/ Manufacturing Engineering. Firmware and Component/Chip level Programming.
• Responsible for defining the PCBA process flow for new PCBA Design and anticipate Risk and initial stage. Responsible for Preparing Effective Costing Analysis of PCBA considering the BOM cost and Process Involved.
• Active Role in Preparing Make or Buy study in analyzing PCB Assembly Process Complexity in order to Select the Manufacturing Plant for PCBA. Drive and Qualify Key Prototype (KP), Engineering Prototype (EP), Manufacturing prototype (MP) and Pilot Build manufacturing with the EMS.
• Responsible to provide the CAPEX (NRE Tooling) required for each project in PCBA Industrialization. Actively Participate in the Electronic Component Selection and Qualification activity to integrate all industrial Risk at Initial project Stage.
• Responsible in Leading the Part Process Evaluation Plan (PPEP), in supplier commitment for Quality and deliverables checklist. Good Knowledge in Defining and Monitoring the final PCBA quality level, perform PFMEA, define the PCBA control plan.
• Actively Participate in Impact Analysis for any Change along with Quality. Actively Participate in RCA, 8D Analysis during any manufacturing Issues.
• Responsible in Creation and managing all PCBA Deliverable Documents in Common database. Responsible in Creation and Sharing ECN (Engineering Change Notice) to Manufacturing Plant (along with relevant new data files) for every AN (Application Note) Release form Design.

NPI Engineer - Kaynes Technology India Pvt Ltd - Bangalore, India

(2016-12 - 2022-09)

• BOM creation/Part number creation in ERP. Developed interactive Excel dashboards using Power Query, showcasing call center metrics, KPIs, and trends for effective communication.
• Advanced product quality planning – planning the activities as per APQP. Utilized Power Pivot in Excel to create data models, enabling advanced analysis and multidimensional reporting capabilities.
• Preparation of bill of material (BOM), PFC, PFD, WI, Control plan and FMEA, CTQ and CAD Ensured data accuracy and reliability through data quality checks, validation techniques, and troubleshooting.
• Engineering change implementation (ECO) for the changes in the product.
• Gerber review and preparing Gerber review checklist and ordering the PCB.
• Stencil ordering and monitoring the processes.
• Prepare plans for all NPI projects and coordinate with all stakeholders and ensure good quality product.
• Escorting proto lots and identifying bottleneck in the process for mass production.
• Preparation of PPAP or FAI reports with ENCR or DFM points.

B-Tech - Engineering - Smt Kamala and Sri Venkappa M. Agadi College of Engineering & Technology (2016)

PUC - Science - Govt P U College, Laxmeshwar (2012)

10th - National public high school, Laxmeshwar (2010)