Nancy Eng Macias

Experienced process engineer mainly focused on the electronics manufacturing services industry. Extensive experience on surface mount technology (SMT), solder paste printing and reflow oven. Exposure to operational areas including engineering, manufacturing, quality and materials in different sectors such as: Telecom, automotive, aerospace and consumer. Interaction with customers and colleagues in cross-functional teams.

Process Engineer at Flextronics Manufacturing (2020-09 – 2023-12)

• Philo – Mass production process leader: thermal pad process improvement, scrap reduction and yield improvement.
• Itron Oconne – NPI. SMT, tooling design, production line configuration and setup, conformal coating and V-CUT PCB depaneling.
• IBM - Responsible for new product introduction (NPI) and transfer to mass production.
• Microsoft - Responsible for NPI and transfer to mass production.

Process Engineer at Riverwood Solutions (2019-05 – 2020-04)

Onsite process auditor representing customer Enphase at a supplier site (Flex south) as a process Engineer. Experienced process engineer mainly focused on the electronics manufacturing services industry. Exposure to operational areas including engineering, manufacturing, quality and materials. Interaction with customers and colleagues in cross-functional teams.

• Onsite process auditor representing customer Enphase at a supplier site (Flex south) as a process Engineer
• Experienced process engineer mainly focused on the electronics manufacturing services industry.
• Exposure to operational areas including engineering, manufacturing, quality and materials.
• Interaction with customers and colleagues in cross-functional teams.

Process Engineer at Flextronics Manufacturing (2016-02 – 2019-01)

Itron Project as an NPI process engineering leader.

• Potting and conformal process implementation, scrap reduction and yield improvement.
• Quotation of EDMs, tooling, equipment, stations and items required for the production line process.
• Purchasing and design of all the above items.
• Executed first engineering runs.

Process Engineering Technician at Flextronics Manufacturing (2008-04 – 2016-02)

• Support to production floor on the analysis and control of defects.
• Configuration and setup of software for SMT equipment such as solder paste printers, SPI, reflow ovens, wave solder, dispensing equipment, router and depaneling.
• Profiling of reflow, wave solder and curing ovens.
• Creating work Instructions.

Debug technician at Sanmina (2007-03 – 2008-04)

• Diagnosing Electronic boards Failures (ICT and functional test)
• Handling of measuring equipment (oscilloscope, multimeter, DAGE, spectrum analyzer).

Bachelor of Science in Communications and Electronics Engineering – UDG (2010)