Joy Faustine Ocampina

A skilled Product Engineer with over 5 years of experience in developing technical blueprints that define how a IC or microchip is electrically connected to its external package. My passion for engineering drives me to innovate and seek improvements that enhance product performance. A Dedicated professional with a reputation for integrity and collaborating across teams to deliver exceptional solutions that meet client needs and exceed expectations.

Product Engineer (Bonding Diagram Engineer) at AMKOR TECHNOLOGY PHILIPPINES (2019-01 – Present)

• Develop detailed 2D bonding diagrams and layouts using CAD tools, specifying wire connection from Die to package substrate or Leadframe, and loop heights for wire bonding.
• Use AutoCAD to simulate and verify the design works correctly, identifying potential failures and design violations early in the process.
• Ensure the Diagram complies with assembly SPECS capabilities to improve production yield.
• Create and maintain documentation, including customer Diagrams, standard operating procedures (SOPs), and bill of materials (BOMs) for assembly.
• Coordinate with Design Engineers, Customers and Process Engineers to align Wire bonding and Die Attach plans with die specifications and substrate layouts.
• Review and optimize designs for New Product Introductions (NPI) to ensure the layout is compatible with existing equipment capabilities, such as those from K&S or ASM Pacific Technology.
• Generate and troubleshoot Off-Line Programs (OLP) using KNS Auto OLP Software for complicated bonding diagrams involving large-scale wire configurations (over two hundred wires).
• Perform thorough wafer / Die verification to detect critical defects or discrepancies, ensuring accuracy and readiness before production begins.
• Conducting root cause failure analysis (RCA) for Wire bonding and Die attach related failures (e.g., non-stick on pad/lead, short circuits, wrong die orientation), optimizing process parameters to improve yield (Cpk/Cp).
• Participate in continuous improvement to enhance bonding processes, reduce defects, and increase yield.

Bachelor of Science in Mechatronics Engineering – Batangas State University (2019)