Nhilkentz Añovert
Failure Analysis Engineer
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About
>7 years of experience in Semiconductor industry particularly in Operations activities, Quality, Reliability and Failure Analysis field. Extensive experience in performing Package Failure Analysis/Construction Analysis on a wide range of semi- conductor parts and products (Laminates, Lead Frames, Flip Chips, System in Package, etc). Expertise in handling analytical equipment (both destructive and nondestructive) such as Scanning Electron Microscope, Scanning Acoustic Tomography, 2D & 3D X-ray, X-ray Fluorescence, Curve Tracer, TDR, FIB, Decapsulation, Polisher, Micro probing, etc.
Computer literate, adequate in using MS Office and other programs.
Experience
7 years of experience in Semiconductor industry particularly in Operations activities, Quality, Reliability and Failure Analysis field.
