Leader, Package Engineering - Advanced Semiconductor Engineering (ASE)
(2024-11)
- Lead the technical account management team.
- In charge of the strategic introduction for advanced semiconductor packaging technologies, aligning supplier capabilities, customer roadmap, and internal manufacturing readiness.
- Evaluate supplier technical capability, scalability, and cost competitiveness to support long-term ecosystem and sourcing strategy.
- Partner with global semiconductor customers to assess commercialization readiness and manufacturing feasibility for AI/Data center applications as well as consumer applications.
- Drive cross-functional alignment across engineering, operations, and suppliers to mitigate strategic technology and supply chain risks.
Section Manager, Business Development & COO Office - NAGASE Taiwan
(2019-05 - 2023-06)
- Worked directly with the General Manager and executive leadership to support corporate strategy, new business initiatives, and global partnership development within the semiconductor sector.
- Identified and evaluated emerging semiconductor technologies, suppliers, and market opportunities through technical, commercial, and strategic analysis to support long-term growth initiatives.
- Conducted strategic assessments of potential partners, including technology capability, manufacturing scalability, competitive positioning, and commercial viability, supporting executive decision-making.
- Negotiated and executed international strategic partnership and distribution agreements, generating multi-million-USD revenue opportunities and enabling ecosystem expansion.
- Built and managed strategic relationships with key industry players including Micron, TSMC Japan (JASM), Infineon, and global semiconductor material suppliers.
- Led cross-functional initiatives spanning engineering, operations, and executive leadership to introduce new semiconductor materials into high-volume manufacturing environments.
- Provided executive-level briefings and market intelligence to senior leadership to support strategic planning and business expansion.
Project Manager - TRICORNTECH Corp.
(2023-07 - 2024-06)
- Led semiconductor business development initiatives targeting Micron, TSMC, and other global manufacturers.
- Conducted customer and market analysis to identify strategic growth opportunities.
- Developed partnerships across semiconductor manufacturing ecosystem.
Process Integration Engineer - Taiwan Semiconductor Manufacturing Company (TSMC)
(2018-01 - 2019-03)
- Supported semiconductor manufacturing optimization and yield improvement in high-volume production.
- Collaborated cross-functionally to improve manufacturing scalability and efficiency.
- Developed deep understanding of semiconductor fabrication and industry ecosystem.
