Pedz Leonardo

Results-driven QRA Senior Engineer with 20+ years in the semiconductor industry, spanning Quality & Reliability Assurance, Final Test Process Engineering, and End-of-Line (EOL) operations. Proven track record managing product lifecycle documentation, PPAP, FMEA, change control, and customer-facing quality programs for global clients including Intel, STMicroelectronics, and Pixelworks. Adept at driving yield improvements, cost reduction initiatives, and cross-functional quality alignment from prototyping through mass production.

Quality & Reliability Assurance – Senior Engineer at Taiwan Semiconductor Co., Ltd. (2026-05 – Present)

• Lead governance, structure, and execution of product lifecycle documentation to ensure full cross-functional compliance.
• Manage the official Process/Program of Record (POR) and own BOM accuracy from initial prototyping through mass production.
• Generate and enforce corporate procedures for PPAP, Change Control, Safe Launch Guidelines, and Site Transfer Qualification in alignment with industry standards.
• Serve as corporate leader for all manufacturing and non-technical change management initiatives company-wide.
• Oversee IC product marking, packing, and labeling to ensure regulatory and customer compliance.
• Translate engineering designs into accurate inventory, procurement plans, and manufacturing execution documentation.

Final Test Process Engineer at Advanced Semiconductor Engineering (ASE) – Test Division (2013-05 – 2026-05)

• Served as direct customer interface and on-site technical support for test contract manufacturers; resolved quality and technical escalations.
• Led new product introduction (NPI) projects from production qualification through volume production ramp-up.
• Drove cost-saving, yield improvement, and flow optimization projects, achieving measurable reductions in test cost.
• Collaborated with test, application, and design engineers to ensure test coverage aligned with customer datasheets.
• Managed Leadscan yield reviews and identified continuous improvement opportunities.
• Authored and responded to 8D reports for customer complaints; maintained FMEA, Control Plan, and OCAP documentation.
• Key customer accounts: Intel, STMicroelectronics, AMCC, Techpoint, Pixelworks, ISE Labs, DSPG.

EOL Process Engineer – Mark / DTFS / FVI / Packing at Amkor Technology Philippines (2008-07 – 2013-05)

• Provided technical guidance on EOL process implementation (TSSOP, SSOP, TQFP, PLCC, MSOP, SOIC, PDIP) to ensure conformance to specifications.
• Maintained FMEA, Control Plan, SPC, and OCAP; generated 8D reports for quality issues.
• Identified and implemented process modifications to meet yield, quality, and turnaround time targets at optimum cost.
• Acted as Customer Focus Engineer: managed weekly indices updates, customer teleconferences, audit explanations, and yield improvement action plans.
• Supervised operators in process control monitoring and final visual inspection.

End-of-Line Sustaining Maintenance Technician at Allegro Microsystems Philippines, Inc. (2006-11 – 2008-07)

• Performed troubleshooting and repair of EOL equipment including molding, stamping, and DTFS machines (ASM, Sunyang).
• Managed machine software backups, PLC/DOS/Windows-based program uploads, and tool & die machining.
• Conducted technical training for newly hired technicians and OJT personnel.

Bachelor of Engineering in Industrial – Technological University of the Philippines – Taguig Campus (2005-06 – 2007-07)

Diploma in Mechanical Engineering Technology – Technological University of the Philippines – Taguig Campus (2001-06 – 2004-07)

On-the-Job Training in Machinist (TPM Department) – ON Semiconductor Philippines, Carmona, Cavite (2004-02 – 2004-07)