22 packaging engineer opportunities in Phoenix updated today
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· Page 1 / 2Job Details: Job Description: Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies. This role involves working in close collaboration with
Job Description The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Develo
Intel CorporationJob Details: Job Description: In this position, you will be responsible for advancing packaging process development through the following responsibilities: • Develops assembly processes and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platfor
ASM America, Inc.Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semi
PNCInfrastructure Engineer Sr. At PNC, our people are our greatest differentiator and competitive advantage in the markets we serve. We are all united in delivering the best experience for our customers. We work together each day to foster an inclusive workplace culture where all of our employees feel
ASMOverview Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our adva
Job Details: Job Description: ? Join Intel's Innovation Journey Are you passionate about driving breakthrough technologies that power the world's most advanced computing solutions? Intel Foundry Group is seeking a talented Senior Yield Engineer - Substrate & Advanced Packaging to join our Advanced P
Provides expertise on platform engineering, while overseeing the team's effort and meeting customer needs. Uses technical knowledge and industry experience to design, build and maintain technology solutions. Develops software components and hardware for complex projects; aligns these with business s
PowerLattice Technologies IncAbout Us Powerlattice is a well-funded semiconductor start-up company backed by well-known large Silicon Valley VCs. The company is working on the industry’s groundbreaking chiplet solution for a fundamental shift in how high-performance chips get powered, paving the way for the next generation of A
ASMA global semiconductor leader in Phoenix is seeking a Principal Engineer (Hardware) specialized in advanced packaging to drive innovations in semiconductor process technologies. The ideal candidate has 10+ years of experience in thin-film deposition and semiconductor engineering. Responsibilities in
Job Details: Job Description: About Intel Foundry Intel Foundry is revolutionizing the semiconductor industry as a leading systems foundry, delivering breakthrough silicon process and packaging technologies for the AI era. We combine industry-leading technology, extensive IP portfolio, world-class d
A leading semiconductor company seeks a Mechanical Tooling Engineer in Phoenix, Arizona. The role involves driving technology development, leading manufacturing process design, and performing feasibility studies. Candidates must have a Master’s degree in Mechanical Engineering with at least 4 years
IntelJob Details: Job Description: The Role and Impact As a Product Packaging Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products. By applying scientific and engineering princip
ASM CompanyStep into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semi
ASM CompanyStep into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semi
Brewer ScienceBrewer Science, Inc. is a major innovator of high-technology solutions for the semiconductor / microelectronics markets. We are currently seeking a purpose-driven candidate with an ownership mentality to fill an open position as an Advanced Semiconductor Packaging Field Applications Engineer (level
Job Details: Job Description: As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business, reporting directly to the CEO. Foundry Services will be a world-class foundry business and
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Tec
Job Details: Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development Client/Server product substrate technology develop
IntelJob Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Tec
Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of
Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of
Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in advancing Intel's cutting-edge assembly packaging platform technologies. Through your expertise in developing innovative solutions, optimizing processes, and collaborating with cross-functional
Kforce IncResponsibilities Kforce is partnering with an innovative and rapidly growing communications technology company seeking to hire a Senior Packaging Engineer (Microelectronics) in the Tempe, AZ area (hybrid work schedule). Summary: This position would place you as the key Microelectronics Packaging Eng
Kforce IncResponsibilities Kforce is partnering with an innovative and rapidly growing communications technology company seeking to hire a Senior Packaging Engineer (Microelectronics) in the Tempe, AZ area (hybrid work schedule). Summary: This position would place you as the key Microelectronics Packaging Eng
Intel CorporationJob Details: Job Description: As a Silicon Packaging Design Engineer, you will play a pivotal role in driving the development of advanced substrate designs, contributing to the creation of cutting-edge technology that fuels Intel's innovation. You will be responsible for the end-to-end development o
About us One team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We're looking
ViasatAbout us One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking
Jobs via DiceRESPONSIBILITIES Kforce is partnering with an innovative and rapidly growing communications technology company seeking to hire a Senior Packaging Engineer (Microelectronics) in the Tempe, AZ area (hybrid work schedule). Summary This position would place you as the key Microelectronics Packaging Engi
$25,000 – $40,000/year
Estimation confidence: Low
Estimate based on market data for Phoenix. Actual salaries may vary depending on experience, company, and area.
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