Job Details: Job Description: Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development Client/Server product substrate technology develop
A leading semiconductor company in Phoenix, Arizona, seeks a Packaging Process Development Engineer. This role focuses on developing innovative packaging solutions, collaborating with teams to enhance efficiency and sustainability in manufacturing processes. Candidates should possess a Master's degr
A leading semiconductor company is seeking a Packaging Process Development Engineer in Phoenix, Arizona. In this role, you will design innovative packaging solutions that enhance product performance and efficiency. You will collaborate with cross-functional teams and employ problem-solving skills to
Advanced IC Packaging Software Engineer The world is transforming, and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technological advancements and experiences in the world. With a legacy of relentless innovation and a commit
A leading semiconductor solutions provider in Tempe, Arizona is seeking an experienced engineer to design and develop packaging methods for various applications, including automotive and industrial power. The ideal candidate must possess a relevant degree and 10-15 years of experience in package dev
Job Details Job Description: The world is transforming, and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technological advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bri
A leading semiconductor firm in Phoenix, Arizona is seeking an Advanced IC Packaging Software Engineer to work closely with customers on advanced packaging technologies. The ideal candidate will define and implement design tools and methodology, requiring extensive knowledge of C/C++, EDA tools, and
# **Welcome!**## .Packaging Process Development Engineer page is loaded## Packaging Process Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282105# **Job Details:**## Job Description:**The Role and Impact**As a **Product Packaging
# **Welcome!**## .Packaging Process Development Engineer page is loaded## Packaging Process Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Yesterdayjob requisition id: JR0282105# **Job Details:**## Job Description:**The Role and Impact**As a **Product Packag
# **Welcome!**## .Packaging Process Development Engineer page is loaded## Packaging Process Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282105# **Job Details:**## Job Description:**The Role and Impact**As a **Product Packaging
A leading packaging solutions provider seeks an experienced Project Engineer to manage the installation of equipment within manufacturing facilities. This full-time position, based in Phoenix, AZ, offers a salary range of $115,000 - $134,000. The candidate should have over 5 years of experience in t
A leading satellite communication company is seeking a dynamic Mechanical Engineer with satellite thermal analysis experience in Tempe, Arizona. This role involves building thermal models, designing electronics packaging, and collaborating with various teams. A minimum of 8 years in Mechanical Desig
# **Job Details:** ## **Job Description:** The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the
About us One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking
About us One team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We're looking
Position Title: Packaging Development Engineer Location: Remote (Candidates must be based in AZ, CA, MD, IL, or GA ) Classification: Exempt (Salaried) Work Schedules: Full-Time; Requires frequent travel to manufacturing sites in AZ and MD . Summary This role is with a premier specialty contract pack
A leading communications technology company located in Tempe, Arizona is seeking a Packaging Engineer to manage all aspects of packaging development for RF communication devices. This role requires over 10 years of semiconductor packaging experience, understanding of micro-electronic structures, and
A leading semiconductor company seeks a packaging module equipment development engineer in Phoenix, Arizona. This role involves developing assembly processes and optimizing manufacturing efficiency while leading innovation efforts. The ideal candidate should have a degree in Engineering or a related
Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Tec
Job Details: Job Description: The Role and Impact As a Product Packaging Development Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products. By applying scientific and enginee