# **Welcome!**## .Advanced IC Packaging Software Engineer page is loaded## Advanced IC Packaging Software Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Yesterdayjob requisition id: JR0281218# **Job Details:**## Job Description:The world is transforming, and so is Intel
Advanced IC Packaging Software Engineer The world is transforming, and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technological advancements and experiences in the world. With a legacy of relentless innovation and a commit
A leading semiconductor company seeks an Advanced IC Packaging Software Engineer in Phoenix, Arizona. The role involves working with foundry customers on advanced packaging technologies, developing design tools, and employing modern software practices. Applicants should have a degree in Computer Sci
# **Welcome!**## .Packaging Research and Development Engineer page is loaded## Packaging Research and Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282157# **Job Details:**## Job Description:Substrate Packaging Technology Develop
# **Welcome!**## .Packaging Research and Development Engineer page is loaded## Packaging Research and Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282157# **Job Details:**## Job Description:Substrate Packaging Technology Develop
# **Welcome!**## .Packaging Research and Development Engineer page is loaded## Packaging Research and Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Yesterdayjob requisition id: JR0282354# **Job Details:**## Job Description:The Role and ImpactJoin Intel's Ad
# **Welcome!**## .Packaging Research and Development Engineer page is loaded## Packaging Research and Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Todayjob requisition id: JR0282157# **Job Details:**## Job Description:Substrate Packaging Technology Develop
# **Welcome!**## .Packaging Research and Development Engineer page is loaded## Packaging Research and Development Engineerlocations: US, Arizona, Phoenixtime type: Full timeposted on: Posted Yesterdayjob requisition id: JR0282354# **Job Details:**## Job Description:The Role and ImpactJoin Intel's Ad
Job Details: Job Description: As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business, reporting directly to the CEO. Foundry Services will be a world-class foundry business and
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semi
A leading semiconductor company is seeking a Sr. Principal Engineer, Customer Enabling in Phoenix to lead packaging innovations and engage with customers on their needs. This strategic role involves optimizing manufacturing processes and mentoring future leaders while ensuring high quality in produc
An innovating aerospace manufacturer in Chandler, Arizona, is seeking a Project Engineer to lead the design and qualification of airborne electronic equipment. The ideal candidate will have substantial expertise in mechanical design and FAA certification processes. Responsibilities include managing
A leading semiconductor company seeks a Senior Principal Engineer, Customer Enabling, to drive innovation in packaging technologies in Phoenix, AZ. You will engage with customers, lead technical collaborations, and mentor future leaders. Required skills include package design expertise and significa
A leading semiconductor company is seeking a (Senior) Principal Process Engineer to advance semiconductor process technologies. Responsibilities include optimizing processes for Advanced Packaging, conducting experiments, and troubleshooting complex technical issues. The ideal candidate holds a Mast
A leading semiconductor company in Phoenix, Arizona, seeks a Packaging Research and Development Engineer to drive material and process development for substrate packaging technology. The role involves interacting with suppliers and working directly on the factory floor. Candidates should hold a PhD
A leading technology company in Phoenix, Arizona is seeking a Packaging Research and Development Engineer. This role involves working on the factory floor to develop innovative assembly processes critical to future assembly packaging technologies. Candidates should possess a Master’s degree or a Bac
A leading semiconductor company is seeking a Packaging Research and Development Engineer in Phoenix, Arizona. The role focuses on process and material development for advanced substrate packaging technology. The ideal candidate will hold a PhD and have experience in statistical data analysis, Python
A leading technology company in Phoenix seeks a Packaging Research and Development Engineer to innovate assembly processes and equipment for substrate packaging. In this on-site role, you will work closely with suppliers and lead process improvements in a state-of-the-art facility. A Master's degree