Chi-Huan Ho

Over 7+ year of cross-industry experience spanning account management, business development, technology integration, supplier/partner management, and stakeholder relationship development. Strong expertise in building partnership across global market, agreement negotiation and aligning cross-functional teams to achieve business goals. Adept at navigating both technical and commercial domains, with fluency in engaging C-level executives and delivering sustainable growth.

Leader, Package Engineering - Advanced Semiconductor Engineering (ASE)

(2024-11)

• Lead the technical account management team.
• In charge of the strategic introduction for advanced semiconductor packaging technologies, aligning supplier capabilities, customer roadmap, and internal manufacturing readiness.
• Evaluate supplier technical capability, scalability, and cost competitiveness to support long-term ecosystem and sourcing strategy.
• Partner with global semiconductor customers to assess commercialization readiness and manufacturing feasibility for AI/Data center applications as well as consumer applications.
• Drive cross-functional alignment across engineering, operations, and suppliers to mitigate strategic technology and supply chain risks.

Section Manager, Business Development & COO Office - NAGASE Taiwan

(2019-05 - 2023-06)

• Worked directly with the General Manager and executive leadership to support corporate strategy, new business initiatives, and global partnership development within the semiconductor sector.
• Identified and evaluated emerging semiconductor technologies, suppliers, and market opportunities through technical, commercial, and strategic analysis to support long-term growth initiatives.
• Conducted strategic assessments of potential partners, including technology capability, manufacturing scalability, competitive positioning, and commercial viability, supporting executive decision-making.
• Negotiated and executed international strategic partnership and distribution agreements, generating multi-million-USD revenue opportunities and enabling ecosystem expansion.
• Built and managed strategic relationships with key industry players including Micron, TSMC Japan (JASM), Infineon, and global semiconductor material suppliers.
• Led cross-functional initiatives spanning engineering, operations, and executive leadership to introduce new semiconductor materials into high-volume manufacturing environments.
• Provided executive-level briefings and market intelligence to senior leadership to support strategic planning and business expansion.

Project Manager - TRICORNTECH Corp.

(2023-07 - 2024-06)

• Led semiconductor business development initiatives targeting Micron, TSMC, and other global manufacturers.
• Conducted customer and market analysis to identify strategic growth opportunities.
• Developed partnerships across semiconductor manufacturing ecosystem.

Process Integration Engineer - Taiwan Semiconductor Manufacturing Company (TSMC)

(2018-01 - 2019-03)

• Supported semiconductor manufacturing optimization and yield improvement in high-volume production.
• Collaborated cross-functionally to improve manufacturing scalability and efficiency.
• Developed deep understanding of semiconductor fabrication and industry ecosystem.

Master of Science - Biochemical Science - National Taiwan University

Bachelor of Science - Life Science - National Tsing Hua University